Protecting Hydrology Science in the Patenting System
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- trude@rntfoil.com
- ttonon@ailr.com
- tunc.icoz@crd.ge.com
- turner.rh@pg.com
- twang@scj.com
- twatanabe@nikon.com
- tysoe@crd.ge.com
- uchiyama.h@pg.com
- ulrich.bonne@honeywell.com
- ulrich.riegel@basf.com
- urankar.ej@pg.com
- usceb@coloplast.com
- usjeh@coloplast.com
- uskct@coloplast.com
- uspv@coloplast.com
- uswkr@coloplast.com
- uwe.kraemer@roche.com
- vadim_krongauz@baxter.com
- vaisman.ib@utrc.utc.com
- valexanian@us.ibm.com
- valyamichev@twt.com
- vanvalkenburgh.ch@pg.com
- varat@microfabrica.com
- vasily.topolkaraev@kcc.com
- velagin@twt.com
- verma.parmesh@utrc.utc.com
- vesa.karppinen@silverbrookresearch.com
- victor.moreno@corus.jnj.com
- victor.tsu@corus.jnj.com
- victoriaw@intven.com
- vidya.ramaswamy@crd.ge.com
- vijaywanth.mathur@azure.org.il
- vinay.singh@kci1.com
- vincenjl@airproducts.com
- vincent.dipalma@abbott.com
- vincent.kung@kcc.com
- virginia.szigeti@honeywell.com
- vivek.kapur@usa.dupont.com
- vkamath@us.ibm.com
- vladimir.aleksic@nitto.com
- volker.zimmer@roche.com
- vredenbregfpmt@bruker-axs.com
- vrtisrn@airproducts.com
- vsstenkamp@battelle.org
- vynalekjh@corning.com
- wainwright@aerogrow.com
- wallace.parce@caliperls.com
- walter.chappas@novolon.com
- walter.l.white@boeing.com
- walter.w.karnstein@hp.com
- walter.weissman@exxonmobil.com
- wan.ji@invitrogen.com
- wang.yi@abbott.com
- wangz@kaz.com
- ware.bill@nano-tex.com
- warren.am@pg.com
- washburn@coadna.com
- wasson.mh@pg.com
- watkins.marcella@shell.com
- wayne.anderson@honeywell.com
- wayne.egan@xerox.com
- wayne.rasmussen@bd.com
- wayne.rasmussen@bd.com
- waynejaeschke@corus.jnj.com
- wbkolb@mmm.com
- wbowers@sageproducts.com
- wbrose@lexmark.com
- wchen@dowc.com
- wchen@dowcorning.com
- wciorka.m@pg.com
- webb.kl@pg.com
- wei.chen@dowcorning.com
- wei.ks@pg.com
- weirich.dm@pg.com
- welling.jh@pg.com
- wendell.twelves@utrc.utc.com
- werner.oberegger@biovail.com
- westerheide.l@pg.com
- weston.harding@bd.com
- weston.harding@bd.com
- weston.harding@bd.com
- wetegrotenhuis@battelle.org
- whitmer.ll@pg.com
- wilfried.schmid@roche.com
- wilksss@corning.com
- william.allen@bd.com
- william.bucher@tek.com
- william.f.kaemmerer@medtronic.com
- william.kaemmerer@medtronic.com
- william.kelly@eesus.jnj.com
- william.phillips@medtronic.com
- william.ryan@pb.com
- william.spencer@bdk.com
- william.zimmerli@kodak.com
- winch.gd@utrc.utc.com
- wiszczyszyn@twt.com
- wkarnstein@hp.com
- wkelly@eesus.jnj.com
- wlarsen@microfabrica.com
- wletson@kcc.com
- wolfgang.schober@infineon.com
- wprince@surfacelogix.com
- w-subido@ti.com
- wtong@surfacelogix.com
- wudj@airproducts.com
- wwood@cellresin.com
- xiang.zhang@abbott.com
- xiao.zhou@hp.com
- xiaochuan.zhou@invitrogen.com
- xiaoming.ren@mtimicrofuelcells.com
- xiaoqing.li@usa.dupont.com
- xiaoyuan.chang@utrc.utc.com
- xing.su@intel.com
- xue@coadna.com
- xuedong.song@kcc.com
- xufan.tseng@iff.com
- ya-huei.chin@battelle.org
- yangl@airproducts.com
- yasutoshi.yamanaka@denso.co.jp
- ycai@us.ibm.com
- ye.ren@siemens.com
- yetter@research.ge.com
- yi.wang@abbott.com
- ying.wang@usa.dupont.com
- yiwei.ding@monsanto.com
- yoel@mit.edu
- yoko.manabe@kao.co.jp
- yong.wang@battelle.org
- yoocharn.jeon@hp.com
- yoshiki.endo@toshiba.co.jp
- young.cha@samsung.com
- y-tung2@ti.com
- yuandong.gu@honeywell.com
- yuichi.ishino@kao.co.jp
- yusuke.kawaguchi@toshiba.co.jp
- yuuki.mukoubara@denso.co.jp
- zappi@research.ge.com
- zenon.mandralis@nestle.com
- zhen.liu@nstarch.com
- znicoson@surossurgical.com
- zohar_yakhini@agilent.com
- zsbiaa@mchips.com
- zwang@kaz.com
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